Indentation Measurement in Thin Plates under Bending Using 3D Digital Image Correlation

Author:

Almazán-Lázaro Juan-AntonioORCID,López-Alba Elías,Rubio-García Luis,Díaz-Garrido Francisco-Alberto

Abstract

In the current paper, a novel experimental methodology to characterize the contact behavior on thin plates under bending is presented. The method is based on the experimental measurement of the indentation observed during contact experiments. Tests were conducted using aluminum thin plates and a steel sphere to evaluate the effect of thickness and bending during contact. For this purpose, a non-contact optical technique, 3D Digital Image Correlation (3D-DIC), has been employed to measure the out-of-plane displacements experienced at the rear face of the specimens (opposite where the contact is occurring). An indirect measurement of the experimental contact law is obtained for different plate thicknesses (2 mm, 3 mm, 4 mm, 5 mm and 6 mm) as the contact load increases. An energy balance performed during contact experiments made it possible to evaluate and quantify the applied energy to generate bending and contact deformation. When the specimen thickness increases from 2 mm to 6 mm, contact deformation reaches higher values from the total applied energy. In addition, it is also possible to evaluate the portion of the elastically recovered energy for contact and bending deformation during the unloading. It has been observed that thicker specimens show a lower elastic energy recovery due to bending and a higher elastic energy recovery due to contact. Results clearly show how the ratio between absorbed and applied energy changes as the specimen thickness increases, highlighting the relevance of the proposed method for the characterization of contact behavior in thin plates.

Funder

Airbus Military; CTA (Corporación Tecnológica de Andalucía); and IDEA agency

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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