3D Strain Mapping of Opaque Materials Using an Improved Digital Volumetric Speckle Photography Technique with X-Ray Microtomography

Abstract

Digital volumetric speckle photography (DVSP) method has been used to strain investigation in opaque materials. In this paper, an improved DVSP algorithm is introduced, in which a multi-scale coarse–fine subset calculation process and a subvoxel shifting technique are applied to increase accuracy. We refer to the new algorithm as Multi-scale and Subvoxel shifting Digital Volumetric Speckle Photography (MS-DVSP). The displacement and strain fields of a red sandstone cylinder exposed to uniaxial compression and a woven composite beam under three-point bending are mapped in detail. The characteristics of the interior deformation of the specimens are clearly depicted, thus elucidating the failure mechanism of the materials.