Critical Review on Advanced Cooling Strategies in Friction Stir Processing for Microstructural Control

Author:

Patel Md Saad12ORCID,Immanuel R. Jose23,Rahaman Ariful14,Khan Mohammad Faseeulla5ORCID,Jouiad Mustapha6ORCID

Affiliation:

1. School of Mechanical Engineering, Vellore Institute of Technology, Vellore 632014, Tamil Nadu, India

2. Advanced Material Development and Characterization Group, Indian Institute of Technology Bhilai, Kutelabhata, Durg 491001, Chhattisgarh, India

3. Department of Mechanical Engineering, Indian Institute of Technology Bhilai, Kutelabhata, Durg 491001, Chhattisgarh, India

4. Centre for Materials Characterization and Testing, Vellore Institute of Technology, Vellore 632014, Tamil Nadu, India

5. Department of Mechanical Engineering, College of Engineering, King Faisal University, Al-Hasa 31982, Saudi Arabia

6. Laboratory of Physics of Condensed Matter (LPMC), University of Picardie Jules Verne, Scientific Pole, 33 Rue Saint-Leu, CEDEX 1, 80039 Amiens, France

Abstract

Friction stir processing (FSP) stands as an effective approach designed for grain refinement and site-specific microstructural modification. The evolving microstructure during FSP is determined by various variables out of which rate of sample cooling is the key parameter. More often, FSP is conducted in naturally flowing air; however, a large number of studies are conducted by researchers across the world; stressing the importance of additional sample cooling strategy for tailoring the material microstructure. Such strategies vary not only in terms of the cooling medium used but also with regard to various other compliant conditions that must be fulfilled for the cooling process to make them successful and economically viable. This work critically reviews the most prevalent methods practiced by various researchers and industries for controlled sample cooling during and after FSP. The underlying mechanisms; advantages; disadvantages; and limitations of each procedure along with the resulting microstructure and material performances are discussed and recommendations are provided

Publisher

MDPI AG

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