Effect of Additive and Current Density on Microstructures and Corrosion Behavior of a Multi-Component NiFeCoCu Alloy Prepared by Electrodeposition

Author:

Wang Ying1,Ma Bingyang1,Li Wei2,Liaw Peter3ORCID,Yang Songpu4,Zhong Ning4

Affiliation:

1. School of Materials Science, Shanghai Dianji University, Shanghai 201306, China

2. School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China

3. Department of Materials Science and Engineering, The University of Tennessee, Knoxville, TN 37996-2200, USA

4. College of Ocean Science and Engineering, Shanghai Maritime University, Shanghai 201306, China

Abstract

High-entropy alloys (HEAs) have been attracting growing interest for decades due to their unique properties. Electrodeposition provides a low-cost and convenient route for producing classified types of HEAs, compared to other synthesis techniques, making it an attention-grabbing method. However, fabricating high-quality HEAs through electrodeposition in aqueous electrolytes remains a great challenge. In this study, the effects of additives and current densities on the compositions, surface morphologies, microstructures, and corrosion behavior of the electrodeposited NiFeCoCu alloy are studied. The results indicate that saccharin plays a key role in achieving a flat and bright surface for NiFeCoCu coatings, while also relieving the internal stress and improving anti-corrosion properties. Electrodeposition under a current density of 20–40 mA/cm2 results in a uniform and dense deposit with favorable properties. The present work provides a low-cost and feasible industrial solution for the preparation of HEA coatings, which holds great potential for innovation in the field of HEA coatings through electrodeposition.

Funder

National Natural Science Foundation of China

National Key R&D Program of China

Shanghai Engineering Technology Research Centre of Deep Offshore Material

Hot Manufacturing

National Science Foundation

Army Research Office

Publisher

MDPI AG

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