Preparation and Properties of Intrinsically Black Polyimide Films with CIE Lab Color Parameters Close to Zero and High Thermal Stability for Potential Applications in Flexible Printed Circuit Boards

Abstract

Black polymer films with high thermal stability are highly desired in flexible electrical and electronic fields. Conventional black polymer films based on high-temperature resistant polymers and black inorganic dyes are usually suffered from the poor electrical and tensile properties. In the current work, a series of intrinsically black polyimide (BPI) films with International Commission on Illumination (CIE) Lab optical parameters close to zero and high thermal stability have been designed and prepared. For this purpose, an electron-rich aromatic diamine, 4,4′-iminodianiline (NDA), was copolymerized with 1,4-phenylenediamine (PDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA) to afford a series of poly(amic acid) (PAA) solutions, which were then thermally dehydrated to provide the final BPI films at elevated temperatures up to 400 °C in air. The molar fraction of NDA in the total diamine monomers was 0 for BPI-0 (sBPDA-PDA), 10% for BPI-1, 20% for BPI-2, 30% for BPI-3, 40% for BPI-4, 50% for BPI-5, and 100% for BPI-6. For comparison, two referenced polyimide (PI) films, including PI-ref1 and PI-ref2, were prepared according to a similar procedure. The former was derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) and the latter was from PMDA and NDA. The BPI films exhibited an increasing degree of blackness with the increasing contents of NDA units in the polymer films. For example, the BPI-6 (sBPDA-NDA) film exhibited the optical transmittance of 1.4% at a wavelength of 650 nm (T650), which was obviously lower than those of PI-ref1 (T650 = 74.6%) and PI-ref2 (T650 = 3.6%). In addition, the BPI-6 film showed the CIE Lab parameters of 0.39 for L*, 2.65 for a*, 0.66 for b*, and haze of 1.83, which was very close to the criterion of “pure blackness” for polymer films (L* = a* = b* = 0). At last, incorporation of the NDA units in the rigid-rod BPI-0 (BPDA-PDA) film slightly deteriorated the high-temperature dimensional stability of the derived BPI films. BPI-6 film showed a linear coefficient of thermal expansion (CTE) value of 34.8 × 10−6/K in the temperature range of 50 to 250 °C, which was higher than those of the BPI-0 (CTE = 12.3 × 10−6/K), PI-ref1 (CTE = 29.5 × 10−6/K), and PI-ref2 (CTE = 18.8 × 10−6/K) films. Nevertheless, the BPI films maintained good thermal stability with the 5% weight loss temperatures (T5%) higher than 590 °C, and the glass transition temperatures (Tg) higher than 340 °C.