A CFD Comparative Study of Bubbling Fluidized Bed Behavior with Thermal Effects Using the Open-Source Platforms MFiX and OpenFOAM

Author:

Reyes-Urrutia AndrésORCID,Venier CesarORCID,Mariani Néstor JavierORCID,Nigro NorbertoORCID,Rodriguez RosaORCID,Mazza GermánORCID

Abstract

This work studies the performance of two open-source CFD codes, OpenFOAM and MFiX, to address bubbling fluidized bed system at different temperature and heat transfer conditions. Both codes are used to predict two parameters that are relevant for the design of fluidized units: the minimum fluidization velocity as a function of the temperature of the bed and wall-to-bed heat transfer coefficient from a lateral wall and from internal tubes. Although the CFD solvers are structuraly similar, there are some key differences (available models, meshing techniques, and balance formulations) that are often translated into differences in the fields prediction. The computational results are compared between both codes and against the experimental data. The minimum fluidization velocity can be correctly predicted with both codes at different temperatures while, in general, for the heat transfer and the fluidization patterns, MFiX shows slightly more accurate results compared to OpenFOAM but with low versatility for meshing curved geometries which might translate into higher computational costs for the same level of accuracy.

Funder

Agencia Nacional de Promoción Científica y Tecnológica

National Scientific and Technical Research Council

National University of San Juan

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3