High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation-Reference-Cited by-同舟云学术

High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation

Published:2023-05-08 Issue:9 Volume:13 Page:1575
ISSN:2079-4991
Container-title:Nanomaterials
language:en
Short-container-title:Nanomaterials

Author:

He Pin-Syuan¹²,Tran Dinh-Phuc¹²,Kuo Ting-Yu¹²,Hsu Wei-You¹²,Lin Huai-En¹²,Shie Kai-Cheng¹²,Chen Chih¹²^ORCID

Affiliation:

1. Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan

2. Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan

Abstract

In this study, thermal and argon (Ar) plasma/wetting treatments were combined to enhance the bonding strength of polyimide (PI) films. Attenuated total reflectance-Fourier transform infrared spectroscopy (ATR-FTIR) was used to analyze the changes in the PI imidization degrees. The contact angles of the PI films were also measured. The results show that the contact angles of the fully cured PI films markedly decreased from 78.54° to 26.05° after the Ar plasma treatments. X-ray photoelectron spectroscopy (XPS) analysis was also conducted on the PI surfaces. We found that the intensities of the C-OH and C-N-H bonds increased from 0% to 13% and 29% to 57%, respectively, after Ar plasma activation. Such increases in the C-OH and C-N-H intensities could be attributed to the generation of dangling bonds and the breakage of the imide ring or polymer long chains. Shear tests were also conducted to characterize the bonding strength of the PI films, which, after being treated with the appropriate parameters of temperature, plasma power, and wetting droplets, was found to be excellent at greater than 35.3 MPa.

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

Link

https://www.mdpi.com/2079-4991/13/9/1575/pdf

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