Effects of Contact Conditions at Wire–Die Interface on Temperature Distribution during Wire Drawing

Abstract

The effects of contact conditions at the wire–die interface on the temperature distribution of the specimen and die are investigated to understand the wire drawing process. Finite element analysis and experiments are performed to analyze the temperature distribution of a drawn wire and die based on different contact conditions using a low-carbon steel wire. The maximum temperature (Tmax) of the die decreases as the contact heat transfer coefficient at the wire–die interface increases, whereas that of the wire increases with the contact heat transfer coefficient. The Tmax of the die and wire decreases with the thermal conductivity of the die. As the thermal conductivity of the die increases, the heat generated by friction is rapidly absorbed into the die, and the Tmax of the die decreases, thus resulting in a decrease in the surface temperature of the wire. The Tmax of both the die and wire linearly increases with the friction factor. In particular, the Tmax of the die more sensitively changes with the friction factor compared with that of the wire. The Tmax of the die linearly increases with the drawing velocity, whereas that of the wire parabolically increases with the drawing velocity. The influence of bearing length on the temperature increase in both the wire and die is insignificant.