Post-Processing Trimming of Silicon Photonic Devices Using Femtosecond Laser

Abstract

Fabrication errors inevitably occur in device manufacturing owing to the limited processing accuracy of commercial silicon photonic processes. For silicon photonic devices, which are mostly processing-sensitive, their performances usually deteriorate significantly. This remains an unsolved issue for mass production, particularly for passive devices, because they cannot be adjusted once fixed in processes. This study presents a post-processing trimming method to compensate for fabrication errors by changing the cladding equivalent refractive indices of devices with femtosecond lasers. The experimental results show that the resonant wavelengths of micro-ring resonators can be regularly shifted within their free spectral range via tuning the illuminating area, focusing position, emitting power, and scanning speed of the trimming femtosecond laser with an acceptable loss increase. These experiments, as well as the trimming experiments in improving the phase balance of Mach-Zehnder interferometer switches, indicate that the femtosecond laser trimming method is an effective and fast method for silicon photonic devices.