Critical Temperature and Frequency Characteristics of GPLs-Reinforced Composite Doubly Curved Panel

Author:

Adamian Armen,Hosseini Safari Keivan,Sheikholeslami Mehdi,Habibi MostafaORCID,Al-Furjan M. S. H.ORCID,Chen Guojin

Abstract

In this study, critical temperature and frequency characteristics of a doubly curved panel are reinforced by graphene nanoplatelets (GPLs) with the aid of a two-dimensional generalized differential quadrature method (2D-GDQM) are investigated. The size effects are included using nonlocal strain gradient theory (NSGT) that has two length scale parameters, and the panel is modeled as a panel using high order shear deformation theory (HSDT). The mechanical properties of GPLs are calculated based on the rule of mixtures and the modified Halpin–Tsai model. The novelty of the current study is in considering the effects of the thermal environment, various boundary conditions, and size effects on the frequency and critical temperature of the GPLRC panel. The validation is performed through the comparison of the numerical results for the frequency of the GPLRC panel and the literature. For more verification, a finite element model is presented using the finite element package to simulate the response of the current structure. The results created from a finite element simulation illustrate a close agreement with the numerical method results. The results demonstrate that GPLs’ weight function, the ratio of panel curvature (R1/R2), GPLs’ pattern, and size-dependent parameters have noticeable effects on the frequency and critical temperature characteristics of the GPLs-reinforced composite (GPLRC) curved panel. The favorable suggestion of this survey is that when designing the GPLRC structure, special attention should be paid to size-dependent parameters because the nonlocal and length scale parameters have an essential role in the static and dynamic behaviors of the GPLRC panel.

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science

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