Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu–Ni–Sn–Mn–Zn Alloy

Abstract

Cu–9Ni–6Sn alloys have received widespread attention due to their good mechanical properties and resistance to stress relaxation in the electronic and electrical industries. The hot compression deformation behaviors of the Cu–9Ni–6Sn–0.3Mn–0.2Zn alloy were investigated using the Gleeble-3500 thermal simulator at a temperature range of 700–900 °C and a strain rate range of 0.001–1 s−1. The microstructural evolution of the Cu–9Ni–6Sn alloy during hot compression was studied by means of an optical microscope and a scanning electron microscope. The constitutive equation of hot compression of the alloy was constructed by peak flow stress, and the corresponding 3D hot processing maps were plotted. The results showed that the peak flow stress decreased with the increase in the compression temperature and the decrease in the strain rate. The hot deformation activation energy was calculated as 243.67 kJ/mol by the Arrhenius equation, and the optimum deformation parameters for the alloy were 740–760 °C and 840–900 °C with a strain rate of 0.001~0.01 s−1. According to Deform-3D finite element simulation results, the distribution of the equivalent strain field in the hot deformation samples was inhomogeneous. The alloy was more sensitive to the deformation rate than to the temperature. The simulation results can provide a guideline for the optimization of the microstructure and hot deformation parameters of the Cu–9Ni–6Sn–0.3Mn–0.2Zn alloy.