THz MEMS Switch Design

Author:

Feng YukangORCID,Tsao Han-yu,Barker N. Scott

Abstract

In this work, an mm-wave/THz MEMS switch design process is presented. The challenges and solutions associated with the switch electrical design, modeling, fabrication, and test are explored and discussed. To investigate the feasibility of this design process, the switches are designed on both silicon and fused quartz substrate and then tested in the 140–750 GHz frequency range. The measurement fits design expectations and simulation well. At 750 GHz the measurement results from switches on both substrates have an ON state insertion loss of less than 3 dB and an OFF state isolation larger than 12 dB.

Funder

U.S. National Ground Intelligence Center

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Design of Broadband High-Frequency Multi-Throw RF-MEMS Switches;Micromachines;2024-06-23

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3. Dielectric Terahertz Characterization of Microwave Substrates and Dry Resist;Crystals;2024-02-21

4. Design and Development of a Low Insertion Loss RF MEMS Shunt Ohmic Switch;IEEE Transactions on Electron Devices;2024

5. A Compact MEMS SP4T Switch Operating in the Wide Terahertz Band;2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP);2023-11-13

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