1. Institute for Electrical and Electronics Engineers (IEEE) (2024, July 10). International Roadmap for Devices and Systems, 2023 Update. Beyond CMOS. Available online: https://irds.ieee.org.
2. Iyer, S., and Samadi, G. (2024, July 10). “Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging” (MRHIEP), Final Report 2023, UCLA Chips and SEMI USA (Sponsored by the National Institute of Standards and Technology). Available online: https://www.semi.org/sites/semi.org/files/2024-02/MRHIEP-Final-report-for-publication.pdf.
3. Semiconductor Research Corporation (2024, July 11). Microelectronics and Advanced Packaging Technologies Roadmap. Available online: https://srcmapt.org.
4. Institute for Electrical and Electronics Engineers (IEEE) (2024, July 10). International Roadmap for Devices and Systems, 2023 Update. Factory Integration. Available online: https://irds.ieee.org.
5. The Chip History Center (2024, July 12). The Virtual Museum of Semiconductors. Available online: https://www.chiphistory.org/711-applied-materials-introduces-producer-wafer-fab-system.