Investigations on the Influence of Subsequent Electron Beam (EB) Remelting on the Microstructure of an Aluminium Nitride Layer Formed on an Aluminium Substrate (Part II)

Abstract

Nitriding of Al alloys leads to the formation of a thin, hard nitride layer (AlN) on the surface. A subsequent EBR can both eliminate the nitriding-related cavities under the nitride layer and increase the hardness of the substrate without melting or destroying the nitride layer. This paper deals with investigations regarding the influence of the energy/heat input on the microstructure within both the AlN layer and the remelted Al substrate. Of particular interest was the interface between the AlN and the Al substrate, which changed to a transition zone with a depth of approximately 80 µm. A range of high-resolution imaging and analytical tools for both scanning and transmission electron microscopy were used for these investigations. Based on the findings from the microstructural investigations, a schematic model was developed of the processes occurring within the nitride layer and at the interface as a result of remelting.