A Coaxial Nozzle Attachment Improving the Homogeneity of the Gas Flow Sputtering

Author:

Alktash Nivin1ORCID,Körner Stefan2,Liu Tianhao1,Pflug Andreas2,Szyszka Bernd1,Muydinov Ruslan1

Affiliation:

1. Technology for Thin-Film Devices, Institute for High-Frequency and Semiconductor System Technologies, Technical University Berlin, Einsteinufer 25, 10587 Berlin, Germany

2. Fraunhofer Institute for Surface Engineering and Thin Films IST, Bienroder Weg 54e, 38108 Braunschweig, Germany

Abstract

The Hollow Cathode Gas Flow Sputtering (GFS) provides special plasma conditions and is of extensive interest as a more affordable alternative to the high vacuum sputtering techniques. In the case of the tubular cathode a circular outlet symmetry stipulates homogeneity issues for both metallic and reactive deposition regimes. Using the results of Direct Simulation Monte Carlo (DSMC), we propose an external coaxial attachment which is manufactured and examined in a nozzle and a diffuser positioning. The impact on the homogeneity of Ti and TiO2 films is examined using profilometry and spectral ellipsometry. Our results demonstrate that the use of the nozzle attachment significantly enhances film homogeneity from about 3 cm2 to more than 12 cm2. It also secures better process control in terms of oxygen stoichiometry and film thickness. Some crucial general issues of the reactive GFS process are discussed.

Funder

German Federal Ministry for Economic Affairs and Energy

Publisher

MDPI AG

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