1. Thin-Film Deposition: Principles and Practice;Smith,1995
2. Principles of Plasma Discharges and Materials Processing;Lieberman,2005
3. The future of equipment development and semiconductor production
4. Wafer-edge yield engineering in leading-edge DRAM manufacturing;Yavas;Semicond. Fabtech,2009
5. Evolution of Across-Wafer Uniformity Control in Plasma Etchhttps://sst.semiconductor-digest.com/2016/08/evolution-of-across-wafer-uniformity-control-in-plasma-etch/