Aluminum Electrodeposition on the Surface of Boron Carbide Ceramics by Use EMIC–AlCl3 Ions Liquid

Abstract

Coating technology is decisively important for metallization of ceramic materials and ceramic metal sealing technology. Previous studies have shown that the network-like structure after penetration of molten aluminum can significantly improve the strength of joint components. However, the direct aluminum coating method is limited by the shape of the substrate. To obtain a dense aluminum film on the surface of B4C, in this study, aluminum was deposited by pulse electroplating in EMIC–AlCl3 ionic liquid. The deposited metals were observed and analyzed by SEM–EDS and XRD. A Vickers hardness tester was adopted as an auxiliary equipment to clarify the film quality. The results show that frequency and duty cycle have significant effects on crystal orientation. The content of oxides in the contact gap reduces the bonding strength of the deposited metal, which provides experimental basis for metal electrodeposition on B4C.