BPN-YOLO: A Novel Method for Wood Defect Detection Based on YOLOv7

Author:

Wang Rijun12,Chen Yesheng12,Liang Fulong12,Wang Bo23,Mou Xiangwei12,Zhang Guanghao12

Affiliation:

1. School of Teachers College for Vocational and Technical Education, Guangxi Normal University, Guilin 541004, China

2. Key Laboratory of AI and Information Processing, Hechi University, Yizhou 546300, China

3. School of Artificial Intelligence and Smart Manufacturing, Hechi University, Yizhou 546300, China

Abstract

The detection of wood defect is a crucial step in wood processing and manufacturing, determining the quality and reliability of wood products. To achieve accurate wood defect detection, a novel method named BPN-YOLO is proposed. The ordinary convolution in the ELAN module of the YOLOv7 backbone network is replaced with Pconv partial convolution, resulting in the P-ELAN module. Wood defect detection performance is improved by this modification while unnecessary redundant computations and memory accesses are reduced. Additionally, the Biformer attention mechanism is introduced to achieve more flexible computation allocation and content awareness. The IOU loss function is replaced with the NWD loss function, addressing the sensitivity of the IOU loss function to small defect location fluctuations. The BPN-YOLO model has been rigorously evaluated using an optimized wood defect dataset, and ablation and comparison experiments have been performed. The experimental results show that the mean average precision (mAP) of BPN-YOLO is improved by 7.4% relative to the original algorithm, which can better meet the need to accurately detecting surface defects on wood.

Funder

Science and Technology Planning Project of Guangxi Province, China

Industry–University Research Innovation Fund Projects of China University

Key Laboratory of AI and Information Processing

Natural Science Foundation Project of Guangxi, China

Scientific Research Project of Hechi University

China University Industry University Research Innovation Fund—New Generation Information Technology Innovation Project Grant

Publisher

MDPI AG

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