Quantitative Relationships between Mechanical Properties and Microstructure of Ti17 Alloy after Thermomechanical Treatment

Author:

Han Yan,Zhao Fei,Liu Yuan,Huang Chaowen

Abstract

In this paper, the relationships between the thermomechanical treatments (TMT), the microstructural evolution the mechanical properties of Ti17 alloy were investigated. The results indicate the coarsening behavior of lamellar α was sensitive to the aging temperature during the process of TMT. The thickness of lamellar α changed from 0.19 to 0.38 μm with an increase in the aging temperature. Moreover, both tensile properties and impact toughness vary with the thickness of lamellar α. The tensile strength increases with the increase of the thickness of lamellar α the plasticity and impact toughness the opposite trend. The quantitative investigations found that there is a linear relationship between the tensile properties and the thickness of lamellar α the tensile properties could be adjusted in the range of 1191~1062 MPa and 1163~1039 MPa to obtain ultimate tensile strength and yield strength as well as 11~16% elongation and 23~33% reduction of area by varying the thickness of lamellar α. Meanwhile, the impact toughness could be adjusted in the range of 46 ~53 J/cm2. The high correlation coefficients imply that the linear equation is reliable to describe the relationships between the mechanical properties and the thickness of lamellar α for Ti17 alloy.

Funder

National Natural Science Foundation of China

Guizhou Science and Technology Project

Publisher

MDPI AG

Subject

General Materials Science,Metals and Alloys

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3