Upcycling of Wood Dust from Particleboard Recycling as a Filler in Lignocellulosic Layered Composite Technology

Abstract

The following research aims to investigate selected properties of three-layer plywood, manufactured using dust from the milling of three-layer particleboard as a filler in the bonding mass. Four types of fillers were considered in the study: commercial rye flour, wood dust naturally occurring in the composition of particles used industrially for particleboard production, wood dust from the first batch of shredded particleboard, and dust from the second round of milled particleboard. The highest modulus of elasticity (MOE) values were observed for the reference samples. Notably, in the samples containing filler sourced from the secondary milling of particleboard, the MOE exhibited an upward trend in conjunction with increasing filler content. The modulus of rupture (MOR) decreased with an elevated degree of filler milling from 73.1 N mm−2 for the native filler, through to 68.9 N mm−2 for the filler after 1st milling, and to 54.5 N mm−2 for the filler after 2nd milling (with 10 parts per weight (pbw) of filler used as an reference), though it increased slightly as the filler content increased. The most favorable outcomes in shear strength were achieved in samples containing filler material from the initial milling of particleboard. The thickness swelling peaked in variants utilizing filler material from both the initial and secondary milling of particleboards (20.1% and 16.6% after 24 h of soaking for samples with 10 pbw filler after the 1st and 2nd milling, respectively, compared to 13.0% for the reference samples). Water absorption testing exhibited a more pronounced response in the newly introduced variants, although the samples containing filler from the initial and secondary milling processes eventually yielded results akin to the reference sample, with naturally occurring dust displaying higher water absorption values. The highest density values (about 1224 kg m−3) were observed in the reference samples. A similar density profile was recorded for samples with five parts of wood flour as filler, although the density of the bonding line was slightly lower in these instances (1130 kg m−3). This research confirms the feasibility of applying the aforementioned dust as an alternative to conventional fillers in plywood technology. It also raises the question of how to effectively remove glue residues from wood-based composite dust, which would enhance their absorption properties.