Atmospheric Cold Plasma as an Alternative to Chlorination in Soft Wheat Flour to Prepare High-Ratio Cakes

Abstract

Chlorination is a common chemical modification process of soft wheat flour to prepare high-ratio cakes. Due to safety and labeling concerns of flour chlorination, alternatives to chlorination have been researched. Atmospheric Cold Plasma (ACP) is an emerging technology which is applicable for a wide range of food and biological components, including cereal grain products. The potential of ACP as an alternative to chlorination for high-ratio cakes has not been researched. Soft wheat flour was treated at 50 kV, 60 kV, and 70 kV each for 5, 6, and 7 min and compared to untreated and chlorinated wheat flour. High-ratio cakes were prepared from the chlorinated, treated, and untreated soft wheat flour and their properties were compared. Changes in the flour properties and the high-ratio cakes were observed at different treatment conditions. It was found that after 50 kV, 6 min, 50 kV, 7 min and 60 kV, 6 min had the better flour pasting properties, higher cake volume, and better texture properties as compared to untreated wheat flour and chlorinated wheat flour. This determines the potential of the application of ACP as an alternative to chlorination or to reduce the use of chlorination in soft wheat flour.