Microstructure and Mechanical Properties of AlN/Al Joints Brazing by a Sputtering Al/Cu Bilayer Film Solder

Abstract

This paper presents a magnetron sputtering Al/Cu bilayer film solder to realize the brazing of AlN ceramic and Al metal. The effect of different temperatures on the structure and mechanical properties of brazed joints is studied. The results show that the sputtered Al particles have a sputtering wetting effect on AlN ceramic. The contact angle of molten Al on AlN ceramic with Al film deposited at 700 °C is as low as about 30°. While the contact angle of molten Al on AlN ceramic without Al film deposited at 1000 °C is about 89°. There is a large amount of Cu enrichment in brazed joints at 600 °C. The weld structure is a mixture of Al solid solution and AlCu compound. The shear strength of the brazed joint is only 70.6 MPa, and the joint fracture shows a large number of brittle fracture morphologies. With the increase of brazing temperature, the phenomenon of Cu enrichment in the joint gradually weakens, and the weld structure gradually transforms into a solid solution of Cu in Al. The shear strength of the brazed joint continues to increase, and the joint fracture morphology gradually changes from brittle fracture to furrow-like plastic fracture morphology. When the brazing temperature is increased to 660 °C, the distribution of Cu in the joint is evenly dispersed, and the shear strength of the brazed joint reaches the highest value of 107.8 MPa. The joint fracture is completely furrow-like plastic fracture morphological composition.