Abstract
A thermal interface material (TIM) is a substance that reduces the thermal resistance between a heat source and heat sink, which facilitates heat conduction towards the outside. In this study, a TiO2 nanosphere (NS)-filler based TIM was fabricated via facile processes such as spin-coating and icing methods. Thermal conductivity of the fabricated TiO2 NS-based TIM was enhanced by increasing the loading contents of the TiO2 NS-filler and successfully cooling down the GPU chipset temperature from 62 °C to 50 °C. Moreover, the TIM with the TiO2 NS-monolayer additionally lowered the GPU temperature by 1–7 °C. The COMSOL simulation results show that the TiO2 NS-monolayer, which was in contact with the heat source, boosts the heat transfer characteristics from the heat source toward the inside of the TIM. The suggested metal oxide monolayer-based TIM is an effective structure that reduces the temperature of the device without an additional filler loading, and it is expected to have a wide range of applications for the thermal management of advanced devices.
Funder
National Research Foundation of Korea
Subject
Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science
Cited by
2 articles.
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