Block Copolymer Adsorption on the Surface of Multi-Walled Carbon Nanotubes for Dispersion in N,N Dimethyl Formamide

Author:

Levin Irena1,Radulescu Aurel2ORCID,Liberman Lucy1ORCID,Cohen Yachin1ORCID

Affiliation:

1. Department of Chemical Engineering, Technion-Israel Institute of Technology, Haifa 3200003, Israel

2. Forschungszentrum Jülich GmbH, Jülich Centre for Neutron Science (JCNS-4) at Heinz Maier-Leibnitz Zentrum (MLZ), D-85747 Garching, Germany

Abstract

This research aims to characterize the adsorption morphology of block copolymer dispersants of the styrene-block-4-vinylpyridine family (S4VP) on the surface of multi-walled carbon nanotubes (MWCNT) in a polar organic solvent, N,N-dimethyl formamide (DMF). Good, unagglomerated dispersion is important in several applications such as fabricating CNT nanocomposites in a polymer film for electronic or optical devices. Small-angle neutron scattering (SANS) measurements, using the contrast variation (CV) method, are used to evaluate the density and extension of the polymer chains adsorbed on the nanotube surface, which can yield insight into the means of successful dispersion. The results show that the block copolymers adsorb onto the MWCNT surface as a continuous coverage of low polymer concentration. Poly(styrene) (PS) blocks adsorb more tightly, forming a 20 Å layer containing about 6 wt.% PS, whereas poly(4-vinylpyridine) (P4VP) blocks emanate into the solvent, forming a thicker shell (totaling 110 Å in radius) but of very dilute (<1 wt.%) polymer concentration. This indicates strong chain extension. Increasing the PS molecular weight increases the thickness of the adsorbed layer but decreases the overall polymer concentration within it. These results are relevant for the ability of dispersed CNTs to form a strong interface with matrix polymers in composites, due to the extension of the 4VP chains allowing for entanglement with matrix chains. The sparse polymer coverage of the CNT surface may provide sufficient space to form CNT-CNT contacts in processed films and composites, which are important for electrical or thermal conductivity.

Funder

ISRAEL SCIENCE FOUNDATION

Publisher

MDPI AG

Subject

General Materials Science,General Chemical Engineering

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