Enhancing the Forming Accuracy of CFRP through a Global Compensation Method by Introducing an Optimal Profile

Author:

Zhang Yongming1,An Luling1,Zhao Cong1

Affiliation:

1. Collage of Mechanical & Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

Abstract

Irreversible curing distortion represents a significant limiting factor in the application of high-performance composite structures. Curing distortion is the deviation of a component’s profile from the theoretical profile after demolding. Introducing the optimal compensation profile into the traditional compensation algorithm represents an effective method to enhance CFRPs’ forming accuracy. For this method, it is necessary to obtain the optimal compensating profile by establishing the coordinate model of the curing process parameter and mold profile compensation. The coordinated control model consists of four parameters: the mean value (Dav), root mean square value (Dmsr), minimum (Dmin), and maximum (Dmax) of curing distortion. Two sizes of composite structural parts are manufactured using the global compensation method. We investigate the influence mechanisms of heating, holding, and cooling times on curing distortion and residual stresses and develop a multi-field coupled finite element model. Strong agreement between the numerical and experimental findings serves as evidence for the effectiveness of the numerical model. The middle layer of the fabricated parts exhibit a reduction in residual stresses as the heating and holding times increase, while an opposite trend is noted with an increase in cooling time. Refining the design of curing process parameters can yield the minimum value of curing deformation within the specified resin system interval. Comparisons indicate that the distortion of the composite wall panel structure is reduced by 86.2% through the use of the global compensation method, demonstrating the validity of this approach for composite structures.

Funder

National Defence Basic Scientific Research Program of China

Publisher

MDPI AG

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