Investigation of Partial Discharge Transformation Characteristics in Polyimide (PI) Insulations under High-Frequency Electric Stress

Abstract

This research delves into the primary issue of polyimide (PI) insulation failures in high-frequency power transformers (HFPTs) by scrutinizing partial discharge development under high-frequency electrical stress. This study employs an experimental approach coupled with a plasma simulation model for a ball–sphere electrode structure. The simulation model integrates the particle transport equation, Poisson equation, and complex chemical reactions to ascertain microscopic parameters, including plasma distribution, electric field, electron density, electron temperature, surface, and space charge distribution. The effect of the voltage polarity and electrical energy on the PD process is also discussed. The contact point plays a pivotal role in triggering partial discharges and culminating in the breakdown of PI insulation. Asymmetry phenomena were found between positive and negative half-cycles by analyzing the PD data stage by stage. A significant number of PDs increased at every stage and the PD amplitude was higher during the negative cycle at the initial stage, but in later stages, the PD amplitude was found to be higher in the positive half-cycle, and scanning electron microscopy (SEM) revealed that the maximum damage occurred near the contact point junction. The simulation results show that the plasma initially accumulates the electron density near the contact point junction. Under the action of the electric field, plasma starts traveling at the PI surface outward from the contact point. Before the PD activity, all parameters have higher values in the plasma head. The microscopic parameters reveal maximum values near the contact point junction, during PD activities where significant damage takes place. These parameter distributions exhibit a decreasing trend over time as when the PD activity ends. The model’s predictions are consistent with the experimental data. The paper lays the foundation for future research in polymer insulation design under high-frequency electrical stress.