Design and Manufacturing of Dielectric Resonators via 3D Printing of Composite Polymer/Ceramic Filaments

Author:

Sofokleous Paris1ORCID,Paz Eva12,Herraiz-Martínez Francisco Javier13ORCID

Affiliation:

1. Institute for Research in Technology (IIT), ICAI School of Engineering, Comillas Pontifical University, Santa Cruz de Marcenado 26, 28015 Madrid, Spain

2. Mechanical Engineering Department, ICAI School of Engineering, Comillas Pontifical University, Alberto Aguilera 25, 28015 Madrid, Spain

3. Electronics, Control and Communications Department, ICAI School of Engineering, Comillas Pontifical University, Alberto Aguilera 25, 28015 Madrid, Spain

Abstract

Rapid technological advancements in recent years have opened the door to innovative solutions in the field of telecommunications and wireless systems; thus, new materials and manufacturing methods have been explored to satisfy this demand. This paper aims to explore the application of low-cost, commercially available 3D-printed ceramic/polymer composite filaments to design dielectric resonators (DRs) and check their suitability for use in high-frequency applications. Three-dimensional printing was used to fabricate the three-dimensional dielectric resonant prototypes. The filaments were characterized in terms of their thermal and mechanical properties and quality of printability. Additionally, the filaments’ dielectric properties were analyzed, and the prototypes were designed and simulated for a target frequency of ~2.45 GHz. Afterward, the DRs were successfully manufactured using the 3D printing technique, and no post-processing techniques were used in this study. A simple and efficient feeding method was used to finalize the devices, while the printed DRs’ reflection coefficient (S11) was measured. Results on prototype size, manufacture ease, printability, cost per volume, and bandwidth (BW) were used to evaluate the materials’ suitability for high-frequency applications. This research presents an easy and low-cost manufacturing process for DRs, opening a wide range of new applications and revolutionizing the manufacturing of 3D-printed high-frequency devices.

Funder

Universidad Pontificia Comillas

Publisher

MDPI AG

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