Physical Properties of Paste Synthesized from Wet- and Dry-Processed Silver Powders

Author:

Nam Hyun Jin1ORCID,Shin Minkyung2,Koo Hye Young3ORCID,Park Se-Hoon1,Nam Hyun Min4,Nam Su-Yong5

Affiliation:

1. ICT Device Packaging Research Center, Korea Electronics Technology Institute, Seongnam 13509, Republic of Korea

2. Electronic Convergence Materials and Devices Research Center, Korea Electronics Technology Institute, Seongnam 13509, Republic of Korea

3. Powder Materials Division, Korea Institute of Materials Science, Changwon 51508, Republic of Korea

4. FP Co., Ltd., Busan 47047, Republic of Korea

5. Department of Nanotechnology Engineering, Pukyong National University, Busan 48513, Republic of Korea

Abstract

This study compares the characteristics and low-temperature curing properties of pastes prepared from silver (Ag) powders synthesized by either wet powder (WP) or dry powder (DP) processing. The WP synthesis of electrode particles has the advantage of controlling the average particle size and particle size distribution but the disadvantage of producing low-purity, crystalline particles because they are synthesized through chemical reduction at less than 100 °C. Conversely, the DP synthesis of electrode particles has the advantage of producing pure, highly crystalline particles (due to synthesis at high temperatures) but the disadvantage of a high processing cost. WP and DP were used to manufacture pastes for low-temperature curing, and the physical properties of the pastes and the electrode characteristics after low-temperature curing were compared between powder types. Shear stress as a function of the shear rate shows that the WP paste is a plastic fluid, whereas the DP paste is a pseudoplastic fluid, closer to a Newtonian fluid. Screen printing the Ag pastes and curing for 30 min at 130 °C produces a nonconductive WP paste, whereas it produces a DP paste with a conductivity of 61 mΩ/sq, indicating that the highly crystalline DP paste is advantageous for low-temperature curing.

Funder

Development of Ultra-Light/Ultra-Thin Electronic Device Manufacturing Technology with Free-Form Multifunctional Structure

Publisher

MDPI AG

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