Long-Term Formaldehyde Emission Potential from UF- and NAF-Bonded Particleboards

Abstract

As a result of the dominance of urea formaldehyde (UF)-bonded particleboard, it seemed worthwhile to examine formaldehyde emissions years after production. A California Air Resources Board (CARB) phase II-compliant commercial particleboard produced with a UF resin adhesive was compared to a no-added formaldehyde (NAF)-particleboard produced with Soyad™ adhesive resin for formaldehyde emissions during exposure to elevated humidity and temperature conditions after being in a room at 21 ± 1.9 °C, 50 ± 3.3% relative humidity for 3.5 years. A modified version of EN 717-3 was used to collect formaldehyde emissions under typical along with higher temperature and humidity conditions. The formaldehyde emissions from the commercial particleboard panel bonded with a UF adhesive even after the 3.5 years of exposure greatly increased only during exposure of the panels to elevated heat and humidity compared to typical testing conditions. The amounts were the same as those with the previous shorter-term study. In contrast, formaldehyde emissions from the NAF-bonded particleboard were not as susceptible (in absolute terms) to increases in temperature and relative humidity conditions.