Abstract
This paper presents the design, simulation and mechanical characterization of a newly proposed complementary metal-oxide semiconductor (CMOS)/micro-electromechanical system (MEMS) accelerometer. The monolithic CMOS/MEMS accelerometer was fabricated using the 0.18 μm application-specific integrated circuit (ASIC)-compatible CMOS/MEMS process. An approximate analytical model for the spring design is presented. The experiments showed that the resonant frequency of the proposed tri-axis accelerometer was around 5.35 kHz for out-plane vibration. The tri-axis accelerometer had an area of 1096 μm × 1256 μm.
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Integrated package and calibration of high-g MEMS ASIC acceleration sensor;Measurement;2025-01
2. Design of a Magnetic Sensor with Controllable Two-Axis Synchronous Motion;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21
3. Analytical modeling of an inclined folded-beam spring used in micromechanical resonator devices;Engineering Research Express;2023-07-14
4. A 3-axis capacitive nonlinear MEMS energy harvester simulation: unidirectivity no more?;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
5. MEMS Using CMOS Wafer;3D and Circuit Integration of MEMS;2021-04-23