Abstract
The initial stages of debonding at hard-particle interfaces during rupture is relevant to the fracture of most structural alloys, yet details of the mechanistic process for rupture at the atomic scale are poorly understood. In this study, we employ molecular dynamics simulation of a spherical Al2Cu θ precipitate in an aluminum matrix to examine the earliest stages of void formation and nanocrack growth at the particle-matrix interface, at temperatures ranging from 200–400 K and stresses ranging from 5.7–7.2 GPa. The simulations revealed a three-stage process involving (1) stochastic instantaneous or delayed nucleation of excess free volume at the particle-matrix interface involving only tens of atoms, followed by (2) steady time-dependent crack growth in the absence of dislocation activity, followed by (3) dramatically accelerated crack growth facilitated by crack-tip dislocation emission. While not all three stages were present for all stresses and temperatures, the second stage, termed lattice-trapped delamination, was consistently the rate-limiting process. This lattice-trapped delamination process was determined to be a thermally activated brittle fracture mode with an unambiguous Arrhenius activation energy of 1.37 eV and an activation area of 1.17 Å2. The role of lattice-trapped delamination in the early stages of particle delamination is not only relevant at the high strain-rates and stresses associated with shock spallation, but Arrhenius extrapolation suggests that the mechanism also operates during quasi-static rupture at micrometer-scale particles.
Subject
Inorganic Chemistry,Condensed Matter Physics,General Materials Science,General Chemical Engineering
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献