A Low-Loss, 77 GHz, 8 × 8 Microstrip Butler Matrix on a High-Purity Fused-Silica (HPFS) Glass Substrate

Abstract

A low-loss, compact, ultra-thin, passive, 77 GHz, 8 × 8 microstrip Butler matrix on a 200 μm thick high-purity fused-silica (HPFS) glass substrate embedded in 0.8 μm thick patterned gold conducting layers was developed for low power automotive radars. The first-of-its-kind, HPFS, glass-based Butler matrix comprised 12 hybrid couplers, 16 crossovers, and 8 phase shifters in a footprint area of 19.1 mm × 26.6 mm. The device and the corresponding building blocks were designed and optimized using 3D electromagnetic finite element method (FEM) simulations using the Advanced Design System (ADS) from Keysight™ Technologies. Due to the very-low-loss tangent of the HPFS glass substrate (0.0005 @77 GHz) compared to other common substrate materials and rigorous design optimization, the return loss and isolation of the input ports are both below −20 dB, respectively, as verified by 3D FEM simulations. Due to the absence of any published data on a 77 GHz 8 × 8 Butler matrix, the design was validated by developing a 4 × 4 version of the Butler matrix using the same building blocks and comparing the 3D simulation results in ADS with results published elsewhere that showed that the developed Butler matrix offers lower insertion loss in a 10% smaller footprint area. A low-cost microfabrication method has been developed to fabricate the devices using a standard lift-off process. A scaled version of the device can be used for 5G beamforming applications.