Editorial for the Special Issue on Structural Analyses and Designs for Flexible/Stretchable Electronics-Reference-Cited by-同舟云学术

Editorial for the Special Issue on Structural Analyses and Designs for Flexible/Stretchable Electronics

Published:2023-06-08 Issue:6 Volume:14 Page:1211
ISSN:2072-666X
Container-title:Micromachines
language:en
Short-container-title:Micromachines

Author:

Li Rui¹^ORCID

Affiliation:

1. State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, China

Abstract

Flexible/stretchable electronics constitute a class of prospective technology incorporating stretchable/bendable/twistable components such that unprecedented properties superior to those of conventional rigid/brittle electronics are realized over [...]

Funder

National Natural Science Foundation of China

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

Link

https://www.mdpi.com/2072-666X/14/6/1211/pdf

Reference16 articles.

1. Yu, C., Gao, X., Liao, W., Zhang, Z., and Wang, G. (2022). A highly accurate method for deformation reconstruction of smart deformable structures based on flexible strain sensors. Micromachines, 13.

2. Groth, C., Chiappa, A., Porziani, S., Salvini, P., and Biancolini, M.E. (2022). An RBF meshless approach to evaluate strain due to large displacements in flexible printed circuit boards. Micromachines, 13.

3. Ji, D., Shi, Y., Chen, J., Zhao, Z., and Zhao, G. (2022). Mathematical model for skin pain sensation under local distributed mechanical compression for electronic skin applications. Micromachines, 13.

4. Li, Z., Yu, C., Qi, L., Xing, S., Shi, Y., and Gao, C. (2022). Mechanical behaviors of the origami-inspired horseshoe-shaped solar arrays. Micromachines, 13.

5. He, Z., Shi, Y., Shen, Y., Shen, Z., Zhang, T., and Zhao, Z. (2022). Transient heat conduction in the orthotropic model with rectangular heat source. Micromachines, 13.