Particle Deposition in the Vicinity of Multiple Film Cooling Holes

Author:

Peng Yubo,Xu Guoqiang,Luo Xiang,He Jian,Liu Dongdong

Abstract

Particle deposition on film cooling surface is an engineering issue that degrades the thermal protection of turbine blade. Here, we present a combined experimental and numerical investigation on the particle deposition in the vicinity of multiple film cooling holes to reveal the effect of interactions between cooling outflows on particle deposition. The numerical simulation of film cooling with a group of three rows of straight film cooling holes is conducted and validated by experimental data with blowing ratios ranging from 0 to 0.08. Wax particles with size range from 5 to 40 μm are added in the heated mainstream to simulate the particle deposition in the experiment. The simulation results show the decrease of particle deposition with blowing ratio and various deposition characteristics in different regions of the surface. The flow fields from numerical results are analyzed in detail to illustrate deposition mechanism of the particles in different regions under the interactions of cooling outflows. The cooling air from the holes in the first row reduces the particle concentration near the wall but causes particle deposition in or between the tail regions by the generated flow disturbance. The cooling air from the latter hole separates the diluted flow in the upstream from the wall, and creates a tail region without particle deposition. This revealed particle deposition characteristics under the effect of outflows interaction can benefit the understanding of particle deposition in engineering applications, where multi-row of cooling holes are utilized.

Publisher

MDPI AG

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering

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