Thermally Coupled NTC Chip Thermistors: Their Properties and Applications

Author:

Bodić Milan Z.1ORCID,Aleksić Stanko O.2,Rajs Vladimir M.1ORCID,Damnjanović Mirjana S.1ORCID,Kisić Milica G.1

Affiliation:

1. Faculty of Technical Sciences, University of Novi Sad, 21102 Novi Sad, Serbia

2. Institute of Nuclear Sciences—INN Vinca, 11351 Belgrade, Serbia

Abstract

Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th1 and Th2, which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B10/30 of thermistor resistance was determined. After that, a self–heating current I1 of the input thermistor was measured vs. supply voltage U and ambient temperature Ta as a parameter. Input resistance R1 was determined as a ratio of U and I1 while output thermistor resistance R2 was measured by a multimeter concurrently with the current I1. Temperatures T1 and T2 of both thermistors were determined using the Steinhart–Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.

Funder

Ministry for Science, Technological Development and Innovations of the Republic of Serbia

Publisher

MDPI AG

Reference32 articles.

1. Macklen, D.E. (1979). Thermistors, Electrochemical Pub. Ltd.

2. Buchanan, C.R. (2004). Ceramic Materials for Electronics, Marcel Dekker. [3rd ed.].

3. Fraden, J. (2010). Handbook of Modern Sensors: Physics, Designs, and Applications, Springer. [4th ed.].

4. Thermistors, Their Theory, Manufacture and Application;Scarr;Proc. IEE-Part B Electron. Commun. Eng.,1960

5. Turner, J. (2009). Automotive Sensors, Momentum Press, LLC. Chapter 3.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3