Affiliation:
1. School of Artificial Intelligence, Nanjing University of Information Science and Technology, Nanjing 210044, China
2. School of Electronic and Information Engineering, Nanjing University of Information Science and Technology, Nanjing 210044, China
Abstract
Reconfigurable intelligent surface (RIS) is one of the promising technologies for sixth generation communications due to its advantages including energy saving, high spectral efficiency, etc. However, the non-convex joint beamforming design is a challenge, especially in the multi-hop RIS-assisted communication system. This paper proposes a deep learning-based joint beamforming (DLBF) design, aiming to maximize the system data rate for multi-hop RIS-aided communication systems. The proposed DLBF design consists of the reflection matrices design of all RISs and the transmit beamforming design at the base station, which has a reduced computational complexity. Numerical results show that the proposed DLBF can achieve 1.8 bit/s/Hz sum rate gain compared to the conventional beamforming method for the two-user scenario, which can be enhanced by large-scale users. The sum rate performance can be improved by increasing the number of RISs due to the reflection gain, and corresponding results provide a guidance of the multi-hop number selection for further investigation.
Funder
National Natural Science Foundation of China
Natural Science Foundation of Jiangsu Province of China
Reference20 articles.
1. Towards 6G wireless communication networks: Vision, enabling technologies, and new paradigm shifts;You;Sci. China Inform. Sci.,2021
2. 6G wireless networks: Vision, requirements, architecture, and key technologies;Zhang;IEEE Veh. Technol. Mag.,2019
3. Intelligent reflecting surface enhanced wireless network via joint active and passive beamforming;Wu;IEEE Trans. Wirel. Commun.,2019
4. Reconfigurable intelligent surfaces: Principles and opportunities;Liu;IEEE Commun. Surv. Tutorials,2021
5. Multicell MIMO communications relying on intelligent reflecting surfaces;Pan;IEEE Trans. Wirel. Commun.,2020