A Surrogate Model for the Rapid Evaluation of Electromagnetic-Thermal Effects under Humid Air Conditions

Author:

Zhu Hui1,Wang Hui1,Zhang Han1,Wang Nan1,Ren Qiang12,Chen Yanning3,Liu Fang3,Gao Jie3

Affiliation:

1. School of Electronics and Information Engineering, Beihang University, Beijing 100191, China

2. Zhongguancun Laboratory, Beijing 100190, China

3. Beijing Smart-Chip Microelectronics Technology Co., Beijing 100192, China

Abstract

Integrated circuits are being more and more extensively applied, and the reliability issues of devices are receiving increased attention from researchers. The study of electronic device performance is not limited to the device themselves; these studies also need to consider the operating environment, such as high temperature or high humidity, which requires fluid simulation. However, this approach inevitably increases the complexity of modeling and the difficulty of the equations to be solved. Aiming at the simulation of the thermal performance of a device under coupled humid air conditions, this paper proposes a surrogate model to quickly evaluate the multiphysical effects of humid air and a multiphysical solver based on it. In this research, the finite element method (FEM) is utilized to simulate the multiphysical problem, and the proposed method is verified as being efficient.

Funder

academician and expert Fund of Beijing Smart-chip Microelectronics Technology Co., Ltd.

National Science and Technology Major Project

Stable Operation Project

Publisher

MDPI AG

Reference30 articles.

1. A holistic analysis of circuit performance variations in 3-D ICs with thermal and TSV-induced stress considerations;Sravan;IEEE Trans. Very Large Scale Integr. VLSI Syst.,2015

2. Arvind, R.S., Alessandro, V., Martino, R., Thomas, B., and David, A. (2010, January 7–11). 3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling. Proceedings of the 2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, CA, USA.

3. Influence of humidity on the power cycling lifetime of SiC MOSFETs;Wang;IEEE Trans. Components Packag. Manuf. Technol.,2022

4. A co-simulation method based on coupled thermoelectric model for electrical and thermal behavior of the lithium-ion battery;Huang;IEEE Access,2019

5. Numerical simulation of 3D electromagnetic–thermal phenomena in an induction heated slab;Liu;J. Iron Steel Res. Int.,2020

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3