Exploring Fully Biobased Adhesives: Sustainable Kraft Lignin and 5-HMF Adhesive for Particleboards

Author:

Dorn Liam1ORCID,Thirion Arthur1,Ghorbani Masoumeh1,Olaechea Luis M.1,Mayer Ingo1

Affiliation:

1. Institute for Materials and Wood Technology, Bern University of Applied Sciences (BFH), CH-2500 Biel, Switzerland

Abstract

Most adhesives used in the wood-based panel (WBP) industry are petroleum-based and are associated with environmental impact and price fluctuations. Furthermore, most have potential adverse health impacts, such as formaldehyde emissions. This has led to interest from the WBP industry in developing adhesives with bio-based and/or non-hazardous components. This research focuses on the replacement of phenol-formaldehyde resins by Kraft lignin for phenol substitution and 5-hydroxymethylfurfural (5-HMF) for formaldehyde substitution. Resin development and optimization was carried out regarding varying parameters such as molar ratio, temperature or pH. The adhesive properties were analyzed using a rheometer, gel timer and a differential scanning calorimeter (DSC). The bonding performances were evaluated using an Automated Bonding Evaluation System (ABES). Particleboards were produced using a hot press, and their internal bond strength (IB) was evaluated according to SN EN 319. Hardening of the adhesive could be achieved at low temperatures by increasing or decreasing the pH. The most promising results were obtained at pH 13.7. The adhesive performances were improved by adding filler and extender (up to 28.6% based on dry resin) and several boards were produced reaching P1 requirements. A particleboard achieved a mean IB of 0.29 N/mm2, almost reaching almost P2 requirements. However, adhesive reactivity and strength must be improved for industrial use.

Funder

Innosuisse—Schweizerische Agentur für Innovationsförderung Project

Publisher

MDPI AG

Subject

Polymers and Plastics,General Chemistry

Reference27 articles.

1. (2023, May 05). FAOSTAT. Available online: https://www.fao.org/faostat/en/#data/FO.

2. Thoemen, H., Irle, M., and Sernek, M. (2010). Wood-Based Panels an Introduction for Specialists, Brunel University Press.

3. Formation of the density profile and its effects on the properties of fiberboard;Wong;J. Wood Sci.,2000

4. Pizzi, A., and Mittal, K.L. (2003). Adhesives in the Wood Industry in Handbook of Adhesive Technology, Second Edition, Revised and Expanded, CRC Press. [2nd ed.].

5. Papadopoulou, E., Nakos, P., Tsiantzi, S., Athanassiadou, E., and Chimar Hellas, S.A. (2008, January 5–8). The challenges of Bio-adhesives for the wood composite industries. Proceedings of the 9th Pacific Rim Bio-Based Composites Symposium, Rotorua, New Zealand.

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3