Crack-Based Sensor with Microstructures for Strain and Pressure Sensing

Abstract

Recent extensive research on flexible electronics has led to the development of various flexible sensors. In particular, sensors inspired by the slit organs of a spider, which utilize cracks in a metal film to measure strain, have garnered considerable interest. This method exhibited significantly high sensitivity, repeatability, and durability in measuring strain. In this study, a thin-film crack sensor was developed using a microstructure. The results exhibited its ability to simultaneously measure the tensile force and pressure in a thin film, further expanding its applications. Furthermore, the strain and pressure characteristics of the sensor were measured and analyzed using an FEM simulation. The proposed method is expected to contribute to the future development of wearable sensors and artificial electronic skin research.