A thin film encapsulation layer fabricated via initiated chemical vapor deposition and atomic layer deposition-Reference-Cited by-同舟云学术

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A thin film encapsulation layer fabricated via initiated chemical vapor deposition and atomic layer deposition

Published:2014-05-27 Issue:24 Volume:131 Page:n/a-n/a
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Kim Bong Jun¹,Kim Do Heung¹,Kang Seung Youl²,Ahn Seong Deok²,Im Sung Gap¹

Affiliation:

1. Department of Chemical and Biomolecular Engineering & Graphene Research Center; KI for Nanocentury, KAIST; Daejeon 305-701 Republic of Korea

2. Next Generation Display Research Department; Electronics and Telecommunications Research Institute; Yuseong-gu Daejeon 305-700 Republic of Korea

Funder

KAIST EEWS Research Center

Ministry of Knowledge Economy of Korean government

MKE/KEIT

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/app.40974/fullpdf

Reference25 articles.

1. Ultra barrier flexible substrates for flat panel displays

2. A new encapsulation solution for flexible organic solar cells

3. Gas permeation and lifetime tests on polymer-based barrier coatings

4. Reliability and degradation of organic light emitting devices

5. Organic light-emitting devices with extended operating lifetimes on plastic substrates

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4. Progress on the stability and encapsulation techniques of perovskite solar cells;Organic Electronics;2022-07

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