Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application-Reference-Cited by-同舟云学术

Thermal and mechanical properties of particulate fillers filled epoxy composites for electronic packaging application

Published:2008 Issue:4 Volume:19 Page:308-315
ISSN:1042-7147
Container-title:Polymers for Advanced Technologies
language:en
Short-container-title:Polym. Adv. Technol.

Author:

Teh P. L.,Jaafar M.,Akil H. M.,Seetharamu K. N.,Wagiman A. N. R.,Beh K. S.

Publisher

Wiley

Subject

Polymers and Plastics

Reference22 articles.

1. Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations

2. , , , . Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique. In: 2004 Electronics Packaging Technology Conference, 2004; 47–52.

3. Preparation of epoxy resin/silica hybrid composites for epoxy molding compounds

4. Ultra high thermal conductivity polymer composites

5. Synthesis, characterization and properties of organoclay-modified polyurethane/epoxy interpenetrating polymer network nanocomposites

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