1. Beyne E.(2004)3D interconnection and packaging: Impending reality or still a dream?Proceedings of the IEEE International Solid‐State Circuits Conference ISSCC 004 15–19 February 2004 San Francisco CA USA pp.138–145.
2. Beyne E.(2006)The rise of the 3rd dimension for system integration. Proceedings of the International Interconnect Technology Conference – IITC 5–7 July 2006 San Francisco CA USA pp.1–5.
3. Beyne E.(2006)3D system integration technologies. Proceedings of the IEEE Symposium on VLSI Technology Systems and Applications (VLSI‐TSA) 24–26 April 2006 Hsinchu Taiwan pp.19–25.
4. Interconnect and Packaging Technologies for Realizing Miniaturized Smart Devices
5. Accurate modeling of high-Q spiral inductors in thin-film multilayer technology for wireless telecommunication applications