Direct Deposition of Carbon Films on Tungsten Substrates Using Coaxial Arc Plasma Deposition for Electrochemical Electrode Applications-Reference-Cited by-同舟云学术

Direct Deposition of Carbon Films on Tungsten Substrates Using Coaxial Arc Plasma Deposition for Electrochemical Electrode Applications

Published:2024-05-26 Issue:10 Volume:19 Page:1743-1745
ISSN:1931-4973
Container-title:IEEJ Transactions on Electrical and Electronic Engineering
language:en
Short-container-title:IEEJ Transactions Elec Engng

Author:

Hara Takeshi¹,Moriya Hiroaki²,Ogishima Masumi¹,Nagano Satoki³,Yoshitake Tsuyoshi³

Affiliation:

1. National Institute of Technology (KOSEN) Ariake College 150, Higashihagio‐machi Omuta Fukuoka 836‐8585 Japan

2. Technical Development Department Hokuriku Roka Co., Ltd. 2‐4‐7, Maruyama‐machi Sabae Fukui 916‐0019 Japan

3. Department of Applied Science for Electronics and Materials Kyushu University 6‐1, Kasuga‐koen Kasuga Fukuoka 816‐8580 Japan

Abstract

Carbon films were directly formed on tungsten (W) substrates without an intermediate layer via coaxial arc plasma deposition. The substrate surface was pretreated to remove the native oxide films to improve film adhesion using environmentally friendly alkaline and acidic solutions. The fundamental electrochemical characteristics of the deposited films were similar to those of diamond and diamond‐like carbon films. Thus, the deposited films can be used in the electrodes of highly sensitive electrochemical sensors. © 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.

Funder

Japan Society for the Promotion of Science

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/tee.24118

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