Superconformal Electrodeposition for 3-Dimensional Interconnects-Reference-Cited by-同舟云学术

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Superconformal Electrodeposition for 3-Dimensional Interconnects

Published:2010-09 Issue:3 Volume:50 Page:312-320
ISSN:0021-2148
Container-title:Israel Journal of Chemistry
language:en
Short-container-title:Isr. J. Chem.

Author:

Moffat Thomas P.,Josell Daniel

Publisher

Wiley

Subject

General Chemistry

Reference43 articles.

1. International Technology Roadmap for Semiconductors 2007 Interconnects 2008

2. Three-Dimensional Battery Architectures

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