Anisotropy induced in magnetic field in GNPs/epoxy composites used as an effective heat dissipation electronic packaging material

Author:

Yan Zhengyang1,Zhang Xiaohui1,Gao Yu1,Kong Zisong1,Ma Xiaolong1,Gou Quan1,Liang Huiming2,Cai Xiaoming13,Tan Honglin1,Cai Jinming1ORCID

Affiliation:

1. School of Materials Science and Engineering Kunming University of Science and Technology Kunming China

2. Morion Nanotechnology Co., Ltd Dongguan China

3. Faculty of Mechanical and Electrical Engineering Kunming University of Science and Technology Kunming China

Abstract

AbstractThis article investigates the effect of different magnetic fields on modulating the alignment of graphene nanoplatelets (GNPs) and their impact on the thermal conductivity of epoxy nanocomposites. Various nanocomposite specimens were fabricated with different GNP contents by using magnetically field‐aligned GNPs in the fabrication process to enhance the thermal conductivity. The results showed that the in‐plane thermal conductivity of the Bmf (Bidirectional magnetic field) sample with 5 wt% GNPs added reached 0.75 W m−1 K−1, which is 276.6% higher than that of pure epoxy resin and the anisotropy coefficient (K/K) reached 3.3. In addition, temperature rise tests were performed to simulate the thermal conductivity of nanocomposites used as an electronic packaging material, and the results indicated that the composites achieved a significant increase in in‐plane thermal conductivity with a lower amount of filler. This provides valuable insights into the preparation of thermally conductive composites and demonstrates their potential as a thermal management packaging material for next‐generation electronic devices.

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

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