Curing behavior of epoxy resins in two-stage curing process by non-isothermal differential scanning calorimetry kinetics method-Reference-Cited by-同舟云学术

Curing behavior of epoxy resins in two-stage curing process by non-isothermal differential scanning calorimetry kinetics method

Published:2014-03-29 Issue:17 Volume:131 Page:n/a-n/a
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J. Appl. Polym. Sci.

Author:

Sun He¹²,Liu Yuyan¹²,Wang Youshan²,Tan Huifeng²

Affiliation:

1. School of Chemical Engineering and Technology; Harbin Institute of Technology; Harbin 15000 China

2. National Key Laboratory of Science and Technology on Advanced Composites in Special Environments; Harbin Institute of Technology; Harbin 150001 China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Reference36 articles.

1. Characterization of double network epoxies with tunable compositions

2. Facile tailoring of thermal transition temperatures of epoxy shape memory polymers

3. Pascault , J. P. Williams , R. J. J. Epoxy Polymers New Materials and Innovations 2010

4. Cure kinetics of epoxy resins studied by non-isothermal DSC data

5. Novel, environmentally friendly crosslinking system of an epoxy using an amino acid: Tryptophan-cured diglycidyl ether of bisphenol A epoxy

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