Affiliation:
1. Engineering Research Center of Ministry of Education for Geological Carbon Storage and Low Carbon Utilization of Resources, Beijing Key Laboratory of Materials Utilization of Nonmetallic Minerals and Solid Wastes, National Laboratory of Mineral Materials, School of Materials Science and Technology China University of Geosciences (Beijing) Beijing 100083 China
2. State Key Laboratory of Solidification Processing and School of Materials Science and Engineering Northwestern Polytechnical University Xi'an Shaanxi 710072 China
Abstract
Comprehensive SummaryHydrogen bonding is a vital driving force for organizing the hierarchy of molecular structure, especially in biologic field. Due to its directionality, selectivity and moderate strength, hydrogen bonding has been extensively introduced into the molecular recognition, sensing and electronic devices. Electric measurements at single‐molecule level facilitate the investigation of hydrogen bonds and provide a comprehensive understanding of the electron transport properties governed by the hydrogen bonding, which is essential for the development of self‐assembled electronic systems. This review provides a detailed overview of recent advancements in constructing single‐molecule junctions utilizing intramolecular and intermolecular hydrogen bonding. We first introduce the methods utilized for characterizing the electric and dynamic properties of non‐covalent interactions. Next, we discuss the mechanisms of electron transport, relevant influencing factors, and typical applications utilizing electrical signals based on single‐molecule junctions. Finally, we propose our perspective on the existing challenges and prospective opportunities in utilizing hydrogen bonding for electronic device applications.
Funder
China Postdoctoral Science Foundation
Fundamental Research Funds for the Central Universities
National Natural Science Foundation of China
Cited by
3 articles.
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