Thermal process computing in nanofluid using dissipation and squeezing constraints

Author:

Mishra Nidhish Kumar1,Adnan 2,Ashraf Waqas3,Mir Ahmed4,Kolsi Lioua5ORCID

Affiliation:

1. Department of Basic Science College of Sciences and Theoretical Studies Saudi Electronic University Riyadh Saudi Arabia

2. Department of Mathematics Mohi‐ud‐Din Islamic University Nerian Sharif AJ&K Pakistan

3. Department of Applied Mathematics & Statistics (AM&S) Institute of Space Technology (IST) Islamabad Pakistan

4. Department of Chemical and Materials Engineering College of Engineering Northern Border University Arar Saudi Arabia

5. Department of Mechanical Engineering College of Engineering University of Ha'il Ha'il City Saudi Arabia

Abstract

AbstractThe investigation of thermal mechanisms in traditional as well as advanced fluid phases grabbed huge attention of the engineers around the globe. These fluids have a bright future in numerous fields including but not restricted to chemical, applied thermal, and heat transfer applications. Therefore, the present analysis emphasized on the development and investigation of a new nanofluid model under physical constraints like viscous dissipation, squeezing, and nanoparticle concentration effects. The fourth‐order heat transfer model is formulated using new thermophysical properties of tetra nanofluids and similar transformative functions. Then, the model was analyzed numerically and a deep discussion of the results was provided. It is noticed that the motion reduced near the bottom wall rapidly when the tetra nanoparticles concentration is taken from to and inward the sheet movement enhanced it. The fluid motion can be augmented by accelerating the top sheet in an outward direction by keeping . Moreover, the shear drag increased in the range of to and the heat transfer rate enhanced from to and to when and increased.

Publisher

Wiley

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