The influence of Ti plasma etching pre‐treatment on mechanical properties of DLC film on cemented carbide-Reference-Cited by-同舟云学术

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The influence of Ti plasma etching pre‐treatment on mechanical properties of DLC film on cemented carbide

Published:2021-12-28 Issue: Volume: Page:
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surface & Interface Analysis

Author:

Li Chao¹^ORCID,Huang Lei¹,Yuan Juntang¹,Zhou Di¹

Affiliation:

1. Jiangsu Engineering Laboratory of High‐End Equipment Manufacturing Technology Nanjing University of Science and Technology Nanjing China

Funder

Fundamental Research Funds for the Central Universities

Natural Science Foundation of Jiangsu Province

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sia.7053

Reference43 articles.

1. Diamond‐like carbon thin films for high‐temperature applications prepared by filtered pulsed laser deposition;Balon F;Vacuum,2005

2. Structure, mechanical and tribological properties of diamond‐like carbon films on aluminum alloy by arc ion plating;Zou YS;Vacuum,2012

3. Microstructure, tribological and cutting performance of Ti‐DLC/α‐C:H multilayer film on cemented carbide;Huang L;Surf Coat Technol,2018

4. History of diamond‐like carbon films—from first experiments to worldwide applications;Bewilogua K;Surf Coat Technol,2014

5. Study on structure, mechanical and tribological properties of iron incorporated diamond‐like carbon films;Zhou S;J Non Cryst Solids,2017

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Advances in deposition of diamond films on cemented carbide and progress of diamond coated cutting tools;Vacuum;2023-11

2. Structure and mechanical properties of diamond‐like carbon films prepared by pulsed laser‐induced cathodic vacuum arc technique;Surface and Interface Analysis;2023-06-26

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