Cuprous oxide nanoparticles in epoxy network: Cure reaction, morphology, and thermal stability-Reference-Cited by-同舟云学术

Cuprous oxide nanoparticles in epoxy network: Cure reaction, morphology, and thermal stability

Published:2015-06-30 Issue:10 Volume:55 Page:2293-2306
ISSN:0032-3888
Container-title:Polymer Engineering & Science
language:en
Short-container-title:Polym Eng Sci

Author:

Tresa Sunny Anu¹,Vijayan P. Poornima¹²,George Thresiamma³⁴,Pickering Kim⁵,Mathew Suresh¹⁴,Thomas Sabu¹⁶⁷

Affiliation:

1. School of Chemical Sciences, Mahatma Gandhi University; Priyadarshini Hills Kottayam 686560 Kerala India

2. Center for Advanced Materials; Qatar University; P.O. Box 2713 Doha Qatar

3. Department of Science; Holy Kings' College of Engineering Science & Technology; Pampakuda Ernakulam Kerala India

4. Advanced Molecular Materials Research Centre, Mahatma Gandhi University; Priyadarshini Hills Kottayam 686560 Kerala India

5. Department of Materials and Process Engineering; The University of Waikato; Hamilton New Zealand

6. Faculty of Applied Sciences; International and Inter University Centre for Nanoscience and Nanotechnology, Mahatma Gandhi University; Priyadarshini Hills Kottayam 686560 Kerala India

7. Universiti Teknologi MARA, Faculty of Applied Sciences; 40450 Shah Alam Selongor Malaysia

Funder

CSIR_ SRF (Govt. of India)

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pen.24116/fullpdf

Reference49 articles.

1. Electrical properties of epoxy/silver nanocomposites

2. Effects of mixing procedures on the volume fraction of silver particles in conductive adhesives

3. Electrical relaxations in polymeric particulate composites of epoxy resin and metal particles

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